JPS6225905Y2 - - Google Patents

Info

Publication number
JPS6225905Y2
JPS6225905Y2 JP1981064307U JP6430781U JPS6225905Y2 JP S6225905 Y2 JPS6225905 Y2 JP S6225905Y2 JP 1981064307 U JP1981064307 U JP 1981064307U JP 6430781 U JP6430781 U JP 6430781U JP S6225905 Y2 JPS6225905 Y2 JP S6225905Y2
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
substrate support
sealed semiconductor
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981064307U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57175448U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981064307U priority Critical patent/JPS6225905Y2/ja
Publication of JPS57175448U publication Critical patent/JPS57175448U/ja
Application granted granted Critical
Publication of JPS6225905Y2 publication Critical patent/JPS6225905Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1981064307U 1981-04-30 1981-04-30 Expired JPS6225905Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981064307U JPS6225905Y2 (en]) 1981-04-30 1981-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981064307U JPS6225905Y2 (en]) 1981-04-30 1981-04-30

Publications (2)

Publication Number Publication Date
JPS57175448U JPS57175448U (en]) 1982-11-05
JPS6225905Y2 true JPS6225905Y2 (en]) 1987-07-02

Family

ID=29860379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981064307U Expired JPS6225905Y2 (en]) 1981-04-30 1981-04-30

Country Status (1)

Country Link
JP (1) JPS6225905Y2 (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134570A (ja) * 1983-01-24 1984-08-02 Shin Kobe Electric Mach Co Ltd 燃料電池構造
JPS59117156U (ja) * 1983-01-26 1984-08-07 サンケン電気株式会社 絶縁物封止半導体装置
JPS6164212A (ja) * 1984-09-05 1986-04-02 ユニチカ株式会社 布団用硬綿の製造方法
JPH0334913Y2 (en]) * 1984-12-10 1991-07-24
JP2659540B2 (ja) * 1987-06-19 1997-09-30 オリンパス光学工業株式会社 内視鏡チャンネル插通型超音波プローブ
JPH0328510Y2 (en]) * 1987-10-02 1991-06-19
JP5308979B2 (ja) * 2009-09-30 2013-10-09 新電元工業株式会社 半導体パッケージ
JP2015008309A (ja) * 2014-08-08 2015-01-15 株式会社鷺宮製作所 モールドコイルおよびモールドコイルを用いた電磁弁
JP6818801B2 (ja) * 2019-04-01 2021-01-20 ローム株式会社 パワーモジュールおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS538635B2 (en]) * 1973-07-20 1978-03-30
JPS5149960U (en]) * 1974-10-14 1976-04-15
JPS5816809B2 (ja) * 1978-09-15 1983-04-02 松下電工株式会社 光発振回路
JPS55160449A (en) * 1979-05-31 1980-12-13 Toshiba Corp Semiconductor device
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS613100A (ja) * 1984-06-18 1986-01-09 富士写真フイルム株式会社 放射線増感紙

Also Published As

Publication number Publication date
JPS57175448U (en]) 1982-11-05

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